ACF Anisotropic Conductive Film | Bonding Adhesive

Time 2020-12-09 13:04:33

Web Name: ACF Anisotropic Conductive Film | Bonding Adhesive

WebSite: http://www.acffilm.com

ID:128594

Keywords:

Conductive,Anisotropic,ACF,ACFfilm/tapeAnisotropicconductivefilm|ACFTape|ACFinte

Description:

ACF Anisotropic Conductive Film | Bonding adhesiveACF (Anisotropic conductive film) or ACFtape is an epoxyadhesive system /Elastomer used by electronics industry to make electrical andmechanicalconnections from drive electronics to substrates.ACF Anisotropic Conductive Film are filled with conductive particles which provides electricalinterconnection between pads through the film thickness (z-direction).The conductive particles are distributed far apart thus notelectrically conductive in the plane direction (X Y) of the film.ACF interconnect offers cost savings by substituting conventionalmechanical connectors or soldering interconnect.ACF interconnect allows low height and fine pitch which enables highdensity and miniaturizing of assembly.Our special conductive particle is made from environmental friendlymaterial (ROHs compliance). It provides good metalic bonding.ACF is also supplied in paste form (Anisotropic Conductive Paste) or ACP, but its usage is less popular due to its limitations.ACF is usually kept in Cold storage (-10 ~ +5 degC). Typical shelf-life is about 6 months. ACF BondingDuring ACF bonding, acombination of heat pressure is applied on to chip (FPC/ IC)for an appropriate time. This is during performed using a ACF Bonding MachineConductives particles(each 3~30um) are compressed between IC and substrate (glass / PCB)while insulating materials pushed away. allows the compressed Ni-Au layer on the particles to conductelectricity between the IC and the substrates (z-axis).insulated particles are distributed with a minimum chance of electricalshorting in the x-axis and y-axis.As theepoxy cures and conductive particles are trapped into permanentcompressed form.compressedparticles, by its elastic nature, are constantlypushing outwards tomaintain good electrical conductivity under different environmentalconditions. ApplicationsACF has for many years,been used in LCDglass display applications. Recently, it is also becomingwidelyused inCOF and COB areas.Examplesof ACF applications.- TAB Bonding (TCP-PCB / TCP-LCD)- COG Bonding(IC-LCD)- COB Bonding (IC-PCB)- COF Bonding(IC-FPC)- Plasma Display (FPC-PDP)- Flip Chip PackageACF Types by Applications- High adhesion to plastic PET substrate- Excellent thermal stability- Good contact resistance for reliability- Good corrosion resistance - High adhesion for COF FPC- Good contact resistance for reliability- Excellent chemical resistance- Good for wide bonding temperature range- Replaces solder for lead-free solution - Minimum connecting area of bump : 1500um2.- High reliability and stable adhesion property on 2layer PI film Fine pitch interconnection : min. 6 gap for COG application Minimumconnecting area of bump: 800 2.High reliability and adhesion property. - Fine pitch connection : 50um pitch for TFT-LCD,color STN, EL, High adhesion, high reliability, void free bonding, andrepairable by common solvents- Good thermal stability- Applicable for fine pitch OLB with shorter bondingtime.

TAGS:Conductive Anisotropic ACF ACFfilm/tapeAnisotropicconductivefilm|ACFTape|ACFinte

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ACF film/ tape (or Anisotropic conductive film) is an epoxy system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates. During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time. Conductives particles are compressed between IC and substrate (glass / PCB) while insulating materials pushed away. ACF Anisotropic Conductive Film are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).

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